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Ideal for semiconductor die attach and interconnection between modules and substrates.
The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.
While maintaining the high reliability characteristic of epoxy resin, it achieves rubber-like elasticity and stretch.
NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html
This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.
This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html
